| We're proud to bring you a rich set of technical papers, authored by European designers, on state-of-the-art electronic design which includes topics on: |
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Case study of PCI Express design simulation using IBIS
Presented by: Jeffrey Kaskey & Nirmal Jain, Rambus |
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Design automation for SbSIP Applications
Presented by: Dominique Lohy, Olivier Tesson, Sylvie-Anne Leverd & Benjamin Lamotte, Philips Semiconductors, France |
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Complete Design Flow for RF System-in-Packages
Presented by: Dr. Wolfram Eurskens , Infineon Technologies AG & Dr. Juergen Hartung, Cadence Design Systems GmbH |
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BGAKIT: an original proprietary solution for System In Package design synthesis and verification
Presented by: Tito Lessio, ST Microelectronics |
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Meet your company’s PPL objective and save on procurement.
Presented by: Alain Le Gal, THALES TRT-E |
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Using signal conditioning techniques to overcome the challenges of High Speed channel design
Presented by: Robert Blake, Altera |
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Temperature aware PCB Design
Presented by: Sherman Ikemoto, Flomerics |
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For further information on titles, authors and abstracts visit the site now.
Don't forget the in-depth technical tutorial: From chip to sytstem, package and board. |
