Cadence Roadshow 2004
DAC 2004 News Delivered Straight to You


 
  Dear Cadence Customer,
 
Our free annual roadshow is your opportunity to discover the latest Cadence platform solutions for electronic design technologies and engineering services — Encounter™ digital IC design, Virtuoso® custom design, Incisive™ functional verification and Allegro® system interconnect.

We invite you for an one day event in Bruxelles at Tuesday, June 22nd 2004 to hear all about the new developments recently rolled out at DAC 2004.
 
You can register for this seminar by submitting the form below.
 
We will then send you a detailed agenda of this event, and the access information to the event location.
 
Best Regards

CB Distribution

 

 
Agenda

Following an overview of Cadence platforms and services, and a presentation by our guest speaker, you will have the opportunity to attend two of these in-depth presentations and demos:
 

    Incisive functional verification platform: enables a unified verification methodology, from system to gate level integrating — simulation (multi-mode, multi-language single kernel), static verification, acceleration and emulation (Palladium™), code coverage and assertions. The Incisive platform supports the functional virtual prototype (FVP) concept and enables you to send in production system, SoCs, ASIC and FPGA with functionality under control.
 
    Encounter digital IC design platform for ICs and SoCs: ensures convergence in timing, power and signal integrity, down to nanometer technologies, through silicon virtual prototype (SVP in First Encounter®), global synthesis (RTL Compiler, GPS), NanoRoute™ super-threading graph-based router, CeltIC™ crosstalk analysis, advanced Design for Test and diagnostic tools (Encounter Test).
 
    Virtuoso custom design platform: leapfrog current design solutions in terms of productivity and comprehensive analysis enabling a breakthrough in complexity whilst improving design delays, re-spin and yield — optimisation, corner case analysis, multi-mode simulation, automated custom layout, migration tools, reference flows and up to 10x performance improvement.
 
    Allegro system interconnect platform: a unique co-design solution for system interconnect, from backplane to silicon through to board and package, based on virtual system interconnect models (VSIC), silicon design kits, and a constraint driven board design methodology.

Our field application engineering team will be available to address your questions.

 

 

Registration Form
 
 
Location: Bruxelles, Tuesday June 22nd 2004
  
Selected topics (2 out of 4):
 
Functional Verification: Incisive
 
Digital Implementation: Encounter
 
Mix-Signal and Custom Design: Virtuoso
 
System Interconnect Silicon to Package to Board: Allegro

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