OrCAD 17.2- 2016 Flex and Rigid Flex Technologies
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Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile DevicesTo enable a faster and more efficient flex and rigid-flex design creation critical to IoT, wearables and wireless devices, the OrCAD 17.2-2016 portfolio enables … Read More

OrCAD/Allegro 17.2-2016 Release available
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Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile DevicesCadence Design Systems announced new capabilities for OrCAD® Capture, PSpice® Designer and PCB Designer 17.2-2016 that address challenges with flex and rigid-flex design as … Read More

OrCAD DFM Checker is here!
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OrCAD DFM Checker provides comprehensive, easy to use PCB manufacturing analysis technology that identifies specific design issues that may have an adverse effect on PCB fabrication. Designs that pass standard design rule verification may unknowingly contain critical issues that could … Read More

How to model serial link interfaces using a cut-and-stitch methodology
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Sigrity Tech Tips: how to model serial link interfacesSigrity™ technologists guide you step-by-step on how to model serial link interfaces using a cut-and-stitch methodology. The methodology enables creation of 3D full-wave-accurate s-parameter models 10X faster than traditional approaches.  Watch the … Read More

OrCAD Technology Overview
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Watch this 3 minutes overview video which will give you all the feature highlights in OrCAD PCB Editor, OrCAD Capture and PSpice. 

Where used feature and parts list import in new OrCAD CIP version
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The Component Information Portal offers Cadence OrCAD Capture CIS users a comprehensive, “off-the-shelf” CIS management environment that includes distributor integration and a component library with a pre-defined set of fields. To take advantage of the capabilities offered with the integration … Read More

Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging
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Cadence Design Systems, Inc. announced the availability of the industry’s only foundry-proven IC packaging design and analysis solutions for advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs. The new capabilities enable the faster multi-chip integration that is … Read More

OrCAD Capture Supports Intel Schematic Connectivity Format for Automated Design Reviews
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OrCAD Capture now provides export capability for Intel Schematic Connectivity Format (ISCF), targeted at automating Intel-based design reviews. ISCF was developed by Intel to streamline the collaboration process with its customers. Intel worked with Cadence to develop a direct ISCF … Read More

Arrow Electronics and Cadence Technologies have Collaborated
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Arrow Electronics and Cadence Technologies have collaborated to help enrich the OrCAD Capture user experience. This alliance will accelerate the development of designs for engineers; allowing products to reach the market faster and become more affordable for the consumer. The … Read More

Altium translator available
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With the latest OrCAD/Allegro ISR 16.6.064, an Altium translator is available for all OrCAD/Allegro customers. OrCAD/Allegro users can now translate their Altium designs easily into OrCAD and Allegro. The translator is included in every product license, no extra license or installation is … Read More

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