Date and time: November 12, 2019, 09:30 - 17:00
Location: Inntel Hotel Arts Eindhoven
Rapidly changing market needs, especially in 5G and automotive, have made IC design even more complex. The traditional approach of design partitioning is breaking down, and it’s essential to analyse multiple complex interactions between separate design domains.
Join Cadence at a Custom IC Technology on Tour event that introduces advanced methodologies for greater productivity and design robustness. Learn about technology innovations, new approaches for deep verification across analog and mixed-signal circuits, and new tools for reliability and thermal performance. We also will discuss the needs of cross-fabric RF analysis, heterogeneous chiplet integration, and nanometer Si processes.
Through techtorials and demonstrations, you will learn about:
- Designing high-reliability analog and mixed-signal ICs for mission-critical applications
- System analysis across chip, package, and board
- New technologies in electrical verification and extraction
- Advanced layout methodologies
All seminars are free and open to analog, RF, and mixed-signal IC designers, CAD engineers, and design managers.